News & Product Announcements

Leadframes Meet Exact Thermal & Conductivity Requirements

PEI is now offering a complete line of photochemically etched lead frames for integrated circuit manufacturing. These lead frames are used in a wide range of applications including semiconductors, glass-to-metal seals, relays, and medical applications such as hearing aids.

Using base materials such as kovar, nickel-iron alloys, copper alloys, and pure nickel, PEl can selectively plate lead frames in their entirety or selectively. Plating materials include silver, nickel, gold, tin, tin-lead, or tin-lead reflowed; the plating is configured to meet each customers specific electrical and thermal conductivity requirements. Since the lead frame is the main conduit by which heat flows from the chip to the printed circuit board, PEl can tailor the manufacturing material so that it will maximize the devices operating life for any given application or environment.

Also, because PEl uses photo-tools to manufacture their lead frames, turnaround time is about 1/10 of the time it takes to obtain stamped frames. PEls process may also be used for frames that are too complicated for stamping. Our manufacturing process has achieved ISO-9002 certification and also complies with MIL-I-45208 standards.