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Thermal Planes (Heat Sinks) With Intricate Geometries

PHOTOFABRICATION ENGINEERlNG, INC. (PEI), of Milford, MA, is offering a full line of photoetched thermal planes/heat sinks for thermal management in the electronics, printed circuit board, semiconductor, telecommunications, and aerospace industries. Our product line includes flat, flanged, bent, bossed and risered heat sinks in copper, aluminum, brass and beryllium copper, in thicknesses to 0.080 in. When attached to circuit boards, these products can improve the reliability and performance of electronic, telecommunications, and power conversion systems.

PEI, with the most extensive photo-etching capabilities in the world, can produce even the most intricate geometries at competitive prices. Because PEI performs all of the manufacturing processes in-house (including etching, silkscreening, forming and embossing, and, when necessary, countersinking or reaming of dri11 holes), we also offer the fastest turnaround times in the industry. We can handle orders from prototype through production quantities.

PEI’s design engineering department is available for design assistance to our customers. Our manufacturing process has achieved ISO-9002 certification and also complies with MIL-I-45208 standards. In addition, our plating and finishing operations meet MIL-C-2074B and QQ-N-290A (nickel), MIL-A-8625C (hard anodizing), and MIL-C-5541B (conversion coating) standards.

 

 
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