Photofabrication Engineering Inc. – PEI is a global leader in the supply of photochemically etched metal parts to the microelectronics industry. Examples of these parts are etched Step Lids, Flat Lids, Lid with Getters, Lead Frames (semiconductor/glass-to-metal seals), etched carriers, carriers with solder dams, circuit stators amongst various other metal products. These products can be supplied in an array of different material such as etching grade Iron Nickel Cobalt Alloy or Kovar (ASTM F-15 Alloy), Copper Alloys, Nickel Alloys, Stainless Steel Alloys, Cold Rolled Steels, Aluminum and even Titanium! In addition, various plating and finishing options are available including, Gold and Electrolytic or Electroless Nickel.
All of PEI’s Microelectronic products meet and exceed the most stringent requirements such as ROHS, ITAR & DFARS.
Below are more specifics relative to our Microelectronic Specialties…
Step Lids and Flat Lids
PEI has established an entire department dedicated to the production of custom and standard Step Lids & Flat Lids for seam-weldable microelectronic packages, including lids with getters for hydrogen and moisture absorption. PEI has thousands of standard lid tools available to meet almost every common specification; we also specialize in manufacturing custom lids (with a one-time tooling charge, which may be absorbed on large-volume orders). Our standard base material for lids is etching-grade iron-nickel-cobalt alloy, but in addition we can etch lids from many other materials, including nickel-200, stainless steel, and cold rolled steel. Numerous plating and finishing options are available, including gold plate, electrolytic nickel, and electroless nickel. Selective plating is also available upon request. With our large in-stock inventory of materials, PEI offers the fastest turn-around time for precision lids in the industry.
PEI produces a full line of custom and standard step and flat lids for seam-weldable microelectronic packages. We can also provide these lids with getters that are either screened on or applied with other methods. These getters are used to absorb moisture or residual hydrogen after hermetic package closure. Package and hybrid manufacturers may purchase lids to a given print, or by specifying the package to which the lid will be welded. We will gladly assist in designing a custom lid solution to ensure optimum yields and lid closure. These custom lids are available with a one-time tooling charge, which may be absorbed on large-volume orders.
PEI has etching controls in place to ensure the tightest tolerances on step lid flange areas and maximizes flange uniformity. Our etching process also ensures that the lids edge is square without radii to promote maximum weld schedule yields. Our lids will never cause you sealing failures!
PEI’s team of dedicated Engineers are always at your disposal to help overcome any challenges you may have with sealing your hermetic devices.
Photo Etched Metal Parts for Microelectronics
As well as lids, PEI supplies a wide variety of custom and standard metal parts to the microelectronics industry, including lead frames, Kovar and molybdenum tabs, and chip carriers. We can etch virtually any metal, from basics like copper, brass and stainless steel to precious metals (including silver) to exotic meals such as titanium, molybdenum, and beryllium copper.
PEI has achieved ISO-9001 and AS9100 certifications and, in 2010, was granted certification under the International Traffic in Arms Regulation (ITAR), allowing it to provide weapon systems components and accessories in accordance with the Code of Federal Regulations implemented by the U.S. Department of State.
Another area of expertise for PEI is the manufacture of surface-mount and insert-mount photoetched lead frames to meet exacting electrical, thermal conductivity, and strength requirements for companies providing integrated circuits. These lead frames are used in a wide variety of applications including semiconductors, glass-to-metal seals, and relays.
Using base materials such as kovar, nickel-iron alloys, copper alloys, and pure nickel, PEI can plate lead frames in their entirety or selectively. Lead-free plating materials include silver, nickel, gold, or tin, depending on the customer’s specific electrical and thermal conductivity requirements. Since the lead frame is the main conduit by which heat flows from the chip to the printed circuit board, PEI tailors the manufacturing material so that it will maximize the device’s operating life for any given application or environment.
PEI manufactures high-density lead frames with acute profiles and ultra-fine pitches, allowing for high pin counts. Single- or double-sided lead frames can be etched without incurring the stresses associated with typical machining methods. More importantly, PEI’s process can be used for lead frames that are too complicated for stamping. Dimensions can be held to extremely tight tolerances, with no burrs or other surface irregularities.
PEI’s lead frames range in thickness from 0.5 mil [0.0127 mm] to 40 mil [1.575 mm], with features as small as 4 mil [0.10 mm] on 0.010 in. [0.254 mm) centers, creating lead frames that are strong enough to be handled yet flexible enough to allow bending when necessary.